Tel:+86 755 29081830  

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+86 755 29081830
+86 755 29988819
sales@techson.net
Danah
+86 18148581280
Building 42, Cuigang 5th Industrial Zone, Huaide, Shenzhen
ACF/FPC Bonding Machine
Double head pre-main bonding machine
The product features

1) PLC control system, pulse heating, hot head with titanium, accurate temperature control.

2) color touch screen display input, Chinese menu, all parameters set your browser simple and intuitive.

3) duplex, dual-head work, or so stations can be individually controlled, respectively, to enhance work efficiency.

4) Platform and out of style pick and place material under high magnification alignment camera system, ensure clear alignment products

The product uses

For a variety of TAB, TCP crimping and FPC and LCD, FFC and PCB crimping, widely used capacitive touch screen FPC bonding process.

Technical parameters

1) Heating mode pulse heating

2) Temperature range room temperature --- 499 (each set Step 1 )

3) Accuracy ± 5 temperature difference

4) pressing time 1 --- 99 seconds

5) Crimp pressure Min 3 --- Max 100 f

6) the thermal head flatness ± 5μm (using the sense of pressure paper test)

7) pressing precision Pitch 0.12mm

8) Working pressure 0.5 - 0.7Mpa

9) Main Power Specifications AC 220V ± 10%, 50Hz, 7000W

10) Dimensions (approximately) 1170mm (L) × 930mm (W) × 1460mm (H)

11) body weight (approximately) 500kg

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